Environmental and Reliability Testing
We are able to conduct various simulated environmental tests for your components and materials to investigate their reliability. We also are qualified to inspect electronic assemblies to ECSS standards, namely ECSS-Q-ST-70-61C, with or without environmental testing.
What we can offer
CAF (Conductive Anodic Filament Testing)
We conduct CAF testing using the AutoGen 3 system to assess the electrochemical reliability of PCB materials and insulation systems under accelerated aging conditions. This testing is critical for identifying vulnerability to filament formation and early electrical failures, especially in high-reliability and space environments.
Our testing procedures are aligned with ECSS-Q-ST-70-60C and IPC-TM-650 standards, ensuring compliance with space qualification
Key Capabilities:
- CAF testing under controlled temperature, humidity and bias voltage
- Real-time resistance monitoring and failure detection
- Supports qualification, comparative analysis and failure mechanism studies
- Aligned with ECSS and IPC standards for PCB reliability assessment
Suitable for testing space rated electronic assemblies
SMT (Surface Mount Technology)
We offer evaluation and process development support fur Surface Mount Technology (SMT) and Electronic Bonding Assessment.
Our capabilities allow us to verify high-reliability electronic circuits—including surface mount, through-hole, solderless assemblies, and wire connections for space applications—in compliance with ECSS-Q-ST-70-61C standards. We are an ESA Recommended Category A microsectioning facility (as described in the ESA-TECMSP-MO-013162 – see escies.org for further information).
- Evaluation of solder joints, adhesive bonds, and staking materials
- Process optimization and reliability screening for SMT components
- New soldering materials screening for Space applications
- Visual inspection, cross-sectioning, and failure analysis
- Environmental and thermal stress testing of bonded assemblies
Thermal Cycling
We perform thermal cycling test to evaluate reliability of materials, coatings, assemblies and joints under harsh environment. This technique also helps to regenerate the failure such as thermal fatigue, delamination cracking and material degradation at the simulated environment.
- -40 °C to 180 °C ±3°C/min programable environment chamber.
- Variety of high temperature aging furnaces
- Vacuum and hermetic ovens with inert or custom gas environments for sealed aging studies
- Dry and humidity-controlled conditions for diverse environmental profiles
- Testing of live electronic assemblies under programmed stress cycles. Data logging, failure analysis and report generation in line with ECSS standards
